Thin wafer cassette equipment

Model: WPM-34

Equipment Overview:

For 3/4-inch thin wafers (minimum thickness, 40~600 μm), this allows for precise alignment calibration.

Equipment features:

♦︎ The process automatically loads wafers into trays and cassettes via SECS and local system commands. ♦︎ Packaging includes wafers, trays, foam pads, and disks as cushioning materials. ♦︎ Content identification includes: 1. Cartridge ID: QR code 2. Wafer ID: OCR ♦︎ Cleanliness level: Class 100 ♦︎ UPH>500