Industrial equipment
Equipment front-end module
Equipment Overview:
Suitable for handling 4/6 and 8/12 inch wafer products.
Equipment features:
♦︎ Feeding/Discharging methods: Supports Foup, Open Cassette, and Coin Box (cookie box)
♦︎ Basic functions: Includes Auto Mapping and Notch Alignment
♦︎ Optional features: OCR, Barcode Reader, SCES/GEM
Specifications
External dimensions
Corresponding tablet box
Corresponding wafer
Film transfer efficiency
Cleanliness level
Load Port
weight
Factory Affairs
W1440 × D1260 × H2250
300mm FOUP 25pcs (SEMI E47.1)
FOSB 25 pcs (SEMI M31) 300mm FOUP with 8' Open Cassette SEMI E47.1, E62 standard product
Silicon wafers, 200mm-300mm in diameter, 0.4-1.0mm thick.
200 pieces/h
ISO Class 2 (for FFU use)
2 Port
500Kg
Power supply: AC220V, 50HZ; Dry air: 0.5MPa±10%; Vacuum: better than -53KPa