Multifunctional IGBT Placement Machine

Model: CYG-GM4U-S

Equipment Overview:

This equipment is suitable for hot-press packaging and die bonding of SiC and other wafers.

Equipment features:

♦︎ Supports silver paste or silver film processes ♦︎ Equipped with both heated and standard pick-and-place heads ♦︎ Heated pick-and-place head temperature up to 300℃, force control up to 300N (500N optional) ♦︎ Features track heating function with two heating platforms: preheating and placement. Temperature is settable, range: RT~300℃ (same for preheating and heating) ♦︎ Includes a standard pick-and-place head, enabling wafer transfer from the standard pick-and-place head to the heated pick-and-place head, reducing heating and cooling time and improving production efficiency ♦︎ Equipped with an intelligent temperature monitoring system that automatically generates pressure and temperature profiles ♦︎ Size range: 2x2mm~20x20mm ♦︎ High UPH: 1K (may fluctuate depending on product process requirements (heating temperature, pressurization time)) ♦︎ Nozzle cleaning mechanism: for cleaning the nozzles ♦︎ Optional nitrogen injection module to prevent product oxidation during heating ♦︎ Equipped with an exhaust system to remove all residual gases from the sintering process (can be connected to the factory ventilation system) ♦︎ Flexible configuration with multiple wafer/material feeding methods, and upgrade and expansion capabilities.